Advanced Packaging
  Advanced Packaging is free to qualified professionals. Summary Description
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3. Which format would you prefer to receive your copy of Advanced Packaging? (select only one)
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4. What is the Business or Service performed at this location? (select only one)
Semiconductor Package Manufacturing Industrial Controls
Semiconductor Assembly & Test Services (SATS) Test & Measurement Equipment
Communication Devices/Systems and Consumer Electronic Products Materials/Chemicals/Substrates
Components or Subassemblies Optoelectronic Package/Assembly
Aviation/Aerospace/Navigation & Guidance Systems or Equipment Automotive Electronics
Military Electronics Quality Control & Assurance
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5. What is your primary job function? (select only one)
Packaging/Assembly/Process Engineering Purchasing/Procurement
Engineering Management Corporate Management
Circuit/System Packaging Design Engineering Consultant
Quality Control/Quality Assurance/Test & Measurement Other (please specify)
Research & Development


6. In the performance of my job, I buy, specify and/or influence the purchase of products and services in the following regions: (select all that apply)
China North America
Europe (West) South America
Europe (East, including Russia) Southeast Asia
India Rest of World
Japan None of the Above


7. In the performance of my job, I buy, specify and/or influence the purchase of the following products: (select all that apply)
A. PRODUCTION/ASSEMBLY EQUIPMENT C. CARRIERS & COMPONENTS
Bonding Equipment: Die, Tape, Flip Chip, Wire Chip Capacitors, Resistors, Components
Cleanroom Equipment & Materials Chip Carriers/Lead Frames
Component Placement Integrated Circuits, Hybrids, MCMs
Deposition Equipment Packages/Packaging Materials
Die Sorters/Handlers/Feeders Substrates: Ceramic, Glass, Quartz, Sapphire, Metal
Dispensing/Encapsulation Equipment Sockets
Drilling/Scribing/Dicing/Trimming D. TEST, INSPECTION & DIAGNOSTIC EQUIPMENT
Imaging Lithography Equipment Test Sockets/Burn-in
Laser Mechanical Acoustic/Laser/Vision/X-Ray Inspection Equipment
Optoelectronic Assembly Equipment Automated Test Equipment
Ovens & Furnaces Diagnostic Test Equipment
Positioning Equipment Environmental Testing: Hermetic/Thermal
Repair/Rework Equipment Failure Analysis Equipment
Robotics Optical/Microscopes
Screen Printing Probes
Sealers/Welders Surface Profiling
Surface Preparation E. SOFTWARE
Tools & Fixtures Design (EDA/DFM)
B. MATERIALS & SOLUTIONS Test (QA/QC)
Adhesives & Epoxies Programming
Bonding Materials F. CONTRACT SERVICES
Bonding Wire Assembly
Cleaning/Etching Solutions Consulting
Coatings/Encapsulants/Underfill Design Fabrication
ESD Materials Test (QA/QC)
Plating Materials/Chemicals  
Solder/Fluxes/Pastes  
Thermal Management Materials None of the above
Thick/Thin Film
Optoelectronic Assembly Materials


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1,000 or more 100 to 249
500 - 999 50 to 99
250 to 499 1 to 49


9. What other publications do you receive? (select all that apply)
Chip Scale Review Solid State Technology
Circuits Assembly Semiconductor International
Global SMT & Packaging


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11. In order to verify your request for this publication, without the availability of a signature our audit bureau requires that we ask a personal identifying question. This information is used solely for the purpose of auditing your request.
What is the first letter of your mother's name?


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